Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices (PDF/EPUB Version)

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Description

Description

Author: Xingyou Tian (editor)
Series:
Publisher: Wiley-VCH
Year: 2023
Edition: 1
Language: English
ISSN:

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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices (PDF/EPUB Version)

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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices (PDF/EPUB Version)

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